R&D Centre at Hong Kong Science Park under the plan will conduct independent R&D and production of third-generation semiconductor chips
HONG KONG SAR -
Media OutReach - 16 October 2023 - With support from the Innovation, Technology and Industry Bureau and the Office for Attracting Strategic Enterprises (OASES), the Hong Kong Science and Technology Parks Corporation (HKSTP) has signed a Memorandum of Understanding (MoU) with mainland China-based microelectronics enterprise J
2 Semiconductor (Shanghai) Co.
Read more: HKSTP and J2 Semiconductor Sign MoU to Promote the Development of Microelectronics Industry in...